The 55nm low-power process (55LP) is 90% scaling of the 65nm process, providing customers with a smaller chip size while maintaining the same performance at similar or lower power. The 55nm low-power process has the advantages of high performance and energy saving. Cost optimization can be improved for advanced technologies. 55nm low power provide the standard 1.2V core device 2.5V(UD 1.8V and OD 3.3V) IO device, and widely used in automotive, mobile devices and wireless applications.