The 40nm process has the advantages of high reliability, low cost and high yield. It introduces immersion lithography machines and strained silicon technology to achieve a higher degree of integration than the 55nm process, with an increase in performance of approximately 20% and reduced operating power consumption about 30%, the computing power has been greatly improved, accompanied by the reduction of size and low power consumption. The target products are widely used in consumer electronics, wireless communications, etc.

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